Cycling System is used for temperature
testing, fast thermal cycling, and device
temperature characterization of components,
hybrids, modules, PCBs, and other electronic
and non-electronic assemblies at a precise
temperature from -65 °C to +225 °C.
ThermoTest TS-760 does not Require LN2 or
CO2 thanks to the design and functionality of
the built-in chiller and air dryer.
ThermoTest TS-760 After long - term multi-
condition verification, it can meet the
requirements of more production
environment and engineering environment.
Application
Application
TS-760 the optimal system for testing semiconductor packages, hybrids,
modules, MCMs, PCBs, and small subassemblies. Examples of typical
semiconductor packages that the system can accommodate include PLCC,
DIP, LCC, PGA, SOP, QFP, and others. Custom thermal fixtures are
available to provide a controlled temperature environment for testing
larger modules.
Product characteristic analysis, high and low temperature cycle test,
temperature impact test, failure analysis and other reliability tests.
Features
Features
55°C to +125°C fastest 10seconds
Temperature range of -65°Cto +225°C
Small footprint
Built-in Air Dryer
Fast DUT temperature stabilization time
Fast DUT temperature stabilization time
± 1 °C accuracy with 0.1 °C readout
Air Flow up to 18 SCFM
Frost free operation